18 Years Factory 1/4 Inch Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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All we do is usually affiliated with our tenet " Buyer to start with, Belief to start with, devoting about the food packaging and environmental defense for 1 Mil Copper Foil, Rf Shielding Foil, Shielding Copper Foil, With the eternal goal of "continuous quality improvement, customer satisfaction", we are sure that our product quality is stable and reliable and our products are best-selling at home and abroad.
18 Years Factory 1/4 Inch Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

18 Years Factory 1/4 Inch Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

18 Years Factory 1/4 Inch Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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We'll make every effort and hard work being outstanding and excellent, and speed up our techniques for standing during the rank of global top-grade and high-tech enterprises for 18 Years Factory 1/4 Inch Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Netherlands, Paraguay, Ecuador, As a way to make use of the resource on the expanding information and facts in international trade, we welcome prospects from everywhere on the web and offline. In spite in the top quality products we offer, effective and satisfying consultation service is supplied by our specialist after-sale service group. Solution lists and detailed parameters and any other info weil be sent to you timely for the inquiries. So please get in touch with us by sending us emails or contact us if you have any concerns about our firm. ou can also get our address info from our web site and come to our enterprise. or a field survey of our solutions. We're confident that we are going to share mutual results and build solid co-operation relations with our companions in this market. We're looking forward to your inquiries.
  • The sales manager is very patient, we communicated about three days before we decided to cooperate, finally, we are very satisfied with this cooperation!
    5 Stars By John biddlestone from Cologne - 2017.01.11 17:15
    The quality of the products is very good, especially in the details, can be seen that the company work actively to satisfy customer's interest, a nice supplier.
    5 Stars By Alexander from Berlin - 2017.09.29 11:19
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