2021 China New Design Copper Foil Capacitor - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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carry on to boost, to guarantee products excellent in line with market and consumer standard specifications. Our enterprise has a quality assurance system are actually established for Ipc-4562 Copper Foilcopper Foil Shielding, Phone Copper Foil, Reverse Treated Electrodeposited Copper Foil, We, with great passion and faithfulness, are willing to provide you with perfect services and striding forward with you to create a bright future.
2021 China New Design Copper Foil Capacitor - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

2021 China New Design Copper Foil Capacitor - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

2021 China New Design Copper Foil Capacitor - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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"Sincerity, Innovation, Rigorousness, and Efficiency" could be the persistent conception of our organization for your long-term to establish alongside one another with shoppers for mutual reciprocity and mutual benefit for 2021 China New Design Copper Foil Capacitor - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Hongkong, Mexico, Monaco, We always adhere to follow the honesty, mutual benefit, common development, after years of development and the tireless efforts of all staff, now has perfect export system, diversified logistics solutions, thorough meet customer shipping, air transport, international express and logistics services. Elaborate one-stop sourcing platform for our customers!
  • We have been cooperated with this company for many years, the company always ensure timely delivery ,good quality and correct number, we are good partners.
    5 Stars By Mark from Zurich - 2017.03.28 16:34
    As a veteran of this industry, we can say that the company can be a leader in the industry, select them is right.
    5 Stars By Candance from Iceland - 2018.12.11 14:13
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