2021 High quality Electrodeposited Copper Foils - Hyper Very Low Profile Copper Foil For High Speed Transmission – JM


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2021 High quality Electrodeposited Copper Foils - Hyper Very Low Profile Copper Foil For High Speed Transmission – JM Detail:

JIMA Copper proprietary ultra low roughness treatment process ensures effective adhesion strength for low Dk film materials, for which adhesion strength is difficult to achieve, without sacrificing transmission properties. Due to the recrystallized base foil, it also offers superior bending characteristics for contributing to the next generation of flexible printed circuits.

Detail

● Thickness: 12um 18um 35um
● Standard Width: 1290mm, can be cutting as size request.
● Wooden box package
● ID: 76 mm, 152 mm
● Length: Customized
● Sample can be supply
● Lead time: 15-20days
● High precision cutting equipment cut copper foils according to width required by customers.
● Slitting Working Procedure: Conduct slitting, classification, inspection and package according to requirement for quality, width and weight of copper foils of customers.

Features

● Ultra -low profile, with high peel
● Strength and good etchability
● Low coarsening technology

Application

● High speed digital
● Base station/server
● PPO/PPE
● Use Low coarsening technology ,the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● High frequency transmission circuit / High Speed Transmission.

Typical Properties of Hyper Very Low Profile Copper Foil

Classification

Unit

Requirement

Test Method

Foil Designation

 

T

H

1

IPC-4562A

Nominal thickness

um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285± 10

IPC-TM-650 2.2.12

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

um

≤0.43

IPC-TM-650 2.2.17

Matte side(Rz)

um

1.5-2.0

optical method

Tensile Strength

R.T.(23°C)

Mpa

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Peel Strength(FR-4)

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650 2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Pinholes & porosity

Numbers

No

IPC-TM-650 2.1.2

Anti-oxidization

R.T.(23°C)

Days

90

 

H.T.(200°C)

Minutes

40

 

Standard Width,1295(±1)mm, Width range: 200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1


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2021 High quality Electrodeposited Copper Foils - Hyper Very Low Profile Copper Foil For High Speed Transmission – JM detail pictures


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By using a full scientific excellent administration method, great quality and fantastic religion, we get good reputation and occupied this discipline for 2021 High quality Electrodeposited Copper Foils - Hyper Very Low Profile Copper Foil For High Speed Transmission – JM , The product will supply to all over the world, such as: Mali, Portugal, Boston, Look forward to the future, we will focus more on the brand building and promotion . And in the process of our brand global strategic layout we welcome more and more partners join us, work together with us based on mutual benefit. Let's develop market by fully utilizing our comprehensive advantages and strive for building.
  • After the signing of the contract, we received satisfactory goods in a short term, this is a commendable manufacturer.
    5 Stars By Julie from Malaysia - 2017.07.28 15:46
    Staff is skilled, well-equipped, process is specification, products meet the requirements and delivery is guaranteed, a best partner!
    5 Stars By John biddlestone from Riyadh - 2017.03.28 16:34
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