2021 High quality Electrodeposited Copper Foils - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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In the past few years, our company absorbed and digested advanced technologies both at home and abroad. Meanwhile, our company staffs a team of experts devoted to the development of Copper Nickel Foil, Battery Copper Foil, Rf Shielding Copper Foil, We have a big inventory to fulfill our customer's demands and needs.
2021 High quality Electrodeposited Copper Foils - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

2021 High quality Electrodeposited Copper Foils - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

2021 High quality Electrodeposited Copper Foils - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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We have now a hugely efficient team to deal with inquiries from buyers. Our goal is "100% client gratification by our solution high-quality, rate & our team service" and take pleasure in a great popularity among clients. With several factories, we will provide a wide assortment of 2021 High quality Electrodeposited Copper Foils - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Borussia Dortmund, Houston, Madras, We believe that good business relationships will lead to mutual benefits and improvement for both parties. We have established long-term and successful cooperative relationships with many customers through their confidence in our customized services and integrity in doing business. We also enjoy a high reputation through our good performance. Better performance will be expected as our principle of integrity. Devotion and Steadiness will remain as ever.
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