2021 High quality Electrodeposited Copper Foils - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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"Control the standard by the details, show the power by quality". Our firm has strived to establish a extremely efficient and stable employees crew and explored an effective excellent command method for 5 Mil Copper Foil, 2 Oz Copper Foil Thickness, Emi Shielding Copper Foil 140um, We have experienced manufacturing facilities with more than 100 employees. So we can guarantee short lead time and quality assurance.
2021 High quality Electrodeposited Copper Foils - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

2021 High quality Electrodeposited Copper Foils - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

2021 High quality Electrodeposited Copper Foils - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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Our primary objective is usually to offer our shoppers a serious and responsible small business relationship, offering personalized attention to all of them for 2021 High quality Electrodeposited Copper Foils - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Mombasa, Hongkong, Durban, We will not only continuously introduce technical guidance of experts from both home and abroad, but also develop the new and advanced products constantly to satisfactorily meet the needs of our clients all over the world.
  • The goods are very perfect and the company sales manager is warmful, we will come to this company to purchase next time.
    5 Stars By Pearl from Madagascar - 2018.06.18 17:25
    This manufacturers not only respected our choice and requirements, but also gave us a lot of good suggestions, ultimately, we successfully completed the procurement tasks.
    5 Stars By Albert from Sweden - 2018.02.04 14:13
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