2021 High quality Electrodeposited Copper Foils - Very Low Profile Copper Foil (VLP-S-P/B) – JM

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2021 High quality Electrodeposited Copper Foils - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification		Unit	Requirement								Test Method
Nominal thickness		Um	12	18		25	35	50	70	105	IPC-4562A
Area Weight		g/m²	107±5	153±7		225±8	285± 10	435±15	585± 20	870±30	IPC-TM-650 2.2.12.2
Purity		%	≥99.8								IPC-TM-650 2.3.15
roughness	Shiny side (Ra)	սm	≤0.43								IPC-TM-650 2.3.17
roughness	Matte side(Rz)	um	≤4.5	≤5.0		≤6.0	≤7.0	≤8.0	≤12	≤14	IPC-TM-650 2.3.17
Tensile Strength	R.T.(23°C)	Mpa	≥207				≥276				IPC-TM-650 2.4.18
Tensile Strength	H.T.(180°C)	Mpa	≥138								IPC-TM-650 2.4.18
Elongation	R.T.(23°C)	%	≥4	≥4		≥5	≥8	≥10	≥12	≥12	IPC-TM-650 2.4.18
Elongation	H.T.(180°C	%	≥4	≥4		≥5	≥6	≥8	≥8	≥8	IPC-TM-650 2.4.18
Resistivity		Ω.g/m²	≤0.17 0	≤0.1 66			≤0.16 2		≤0.16 2	≤0.16 2	IPC-TM-650 2.5.14
Peel Strength(FR-4)		N/mm	≥1.0	≥1.3			≥1.6		≥1.6	≥2.1	IPC-TM-650 2.4.8
Pinholes & Porosity		Number			No						IPC-TM-650 2.1.2
Anti-oxidization	R.T.(23°C)	Days			180
Anti-oxidization	H.T.(200°C)	Minutes			30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

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All we do is always involved with our tenet " Consumer initial, Trust first, devoting within the food stuff packaging and environmental defense for 2021 High quality Electrodeposited Copper Foils - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: Malaysia, Poland, Frankfurt, Item have passed by means of the national qualified certification and been well received in our main industry. Our expert engineering team will often be ready to serve you for consultation and feedback. We have been able to also deliver you with cost-free samples to meet your specs. Ideal efforts will probably be produced to deliver you the most beneficial service and solutions. Should really you be interested in our company and solutions, please make contact with us by sending us emails or call us straight away. To be able to know our solutions and enterprise. ar more, you'll be able to come to our factory to see it. We will constantly welcome guests from all over the world to our firm. o build business enterprise. elations with us. You should feel absolutely free to speak to us for organization. nd we believe we are going to share the best trading practical experience with all our merchants.

1 Inch Copper Foil