Excellent quality Copper Foil For Shielding - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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That has a sound small business credit, great after-sales service and modern production facilities, we've earned an outstanding standing amid our buyers across the earth for Ipc-4562 Copper Foilcopper Foil Shielding, Vlp Copper Foil, Copper Foil 1 Mm, We warmly welcome customers, business associations and friends from all over the world to contact us and seek cooperation for mutual benefits.
Excellent quality Copper Foil For Shielding - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Excellent quality Copper Foil For Shielding - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

Excellent quality Copper Foil For Shielding - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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Our rewards are lower costs,dynamic profits team,specialised QC,potent factories,high-quality services for Excellent quality Copper Foil For Shielding - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Australia, United Arab Emirates, Paraguay, Our items have been obtained more and more recognition from foreign clients, and established long term and cooperative relationship with them. We`ll supply the best service for every customer and sincerely welcome friends to work with us and establish the mutual benefit together.
  • This company has the idea of "better quality, lower processing costs, prices are more reasonable", so they have competitive product quality and price, that's the main reason we chose to cooperate.
    5 Stars By Lindsay from British - 2017.05.02 18:28
    The company can keep up with the changes in this industry market, product updates fast and the price is cheap, this is our second cooperation, it's good.
    5 Stars By Atalanta from Marseille - 2018.11.04 10:32
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