Excellent quality Copper Foil For Shielding - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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We have probably the most state-of-the-art output equipment, experienced and qualified engineers and workers, recognized good quality manage systems plus a friendly skilled income workforce pre/after-sales support for Copper Foil Sheets, Thin Copper Foil, 1 Mil Copper Foil, Our company eagerly looks ahead to setting up long-term and pleasant small business partner associations with customers and businessmen from everywhere in the entire world.
Excellent quality Copper Foil For Shielding - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Excellent quality Copper Foil For Shielding - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

Excellent quality Copper Foil For Shielding - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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Which has a positive and progressive attitude to customer's desire, our corporation constantly improves our merchandise quality to satisfy the desires of consumers and further focuses on safety, reliability, environmental demands, and innovation of Excellent quality Copper Foil For Shielding - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Victoria, Greece, Cape Town, Selling our products and solutions causes no risks and brings high returns to your company instead. It is our consistent pursuit to create value for clients. Our company is looking for agents sincerely. What are you waiting for? Come and join us. Now or never.
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