Excellent quality Copper Foil For Shielding - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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Our company promises all buyers of the first-class products and solutions as well as most satisfying post-sale support. We warmly welcome our regular and new shoppers to join us for Copper Foils For Pcb, 6micron Copper Foil, Copper Foil Hte Pcb, We are hunting ahead to building positive and beneficial links with the businesses round the globe. We warmly welcome you to definitely call us to begin discussions on how we can easily bring this into being.
Excellent quality Copper Foil For Shielding - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Excellent quality Copper Foil For Shielding - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

Excellent quality Copper Foil For Shielding - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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We consistently execute our spirit of ''Innovation bringing progress, Highly-quality ensuring subsistence, Administration advertising and marketing gain, Credit history attracting buyers for Excellent quality Copper Foil For Shielding - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Saudi Arabia, Portugal, Hungary, We hope we can establish long-term cooperation with all of the customers. And hope we can improve competitiveness and achieve the win-win situation together with the customers. We sincerely welcome the customers from all over the world to contact us for anything you need!
  • Timely delivery, strict implementation of the contract provisions of the goods, encountered special circumstances, but also actively cooperate, a trustworthy company!
    5 Stars By Gwendolyn from Jamaica - 2017.01.28 18:53
    This is the first business after our company establish, products and services are very satisfying, we have a good start, we hope to cooperate continuous in the future!
    5 Stars By Quyen Staten from Sheffield - 2017.06.16 18:23
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