Factory making Ra Ed Copper Foil - Hyper Very Low Profile Copper Foil For High Speed Transmission – JM


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Factory making Ra Ed Copper Foil - Hyper Very Low Profile Copper Foil For High Speed Transmission – JM Detail:

JIMA Copper proprietary ultra low roughness treatment process ensures effective adhesion strength for low Dk film materials, for which adhesion strength is difficult to achieve, without sacrificing transmission properties. Due to the recrystallized base foil, it also offers superior bending characteristics for contributing to the next generation of flexible printed circuits.

Detail

● Thickness: 12um 18um 35um
● Standard Width: 1290mm, can be cutting as size request.
● Wooden box package
● ID: 76 mm, 152 mm
● Length: Customized
● Sample can be supply
● Lead time: 15-20days
● High precision cutting equipment cut copper foils according to width required by customers.
● Slitting Working Procedure: Conduct slitting, classification, inspection and package according to requirement for quality, width and weight of copper foils of customers.

Features

● Ultra -low profile, with high peel
● Strength and good etchability
● Low coarsening technology

Application

● High speed digital
● Base station/server
● PPO/PPE
● Use Low coarsening technology ,the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● High frequency transmission circuit / High Speed Transmission.

Typical Properties of Hyper Very Low Profile Copper Foil

Classification

Unit

Requirement

Test Method

Foil Designation

 

T

H

1

IPC-4562A

Nominal thickness

um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285± 10

IPC-TM-650 2.2.12

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

um

≤0.43

IPC-TM-650 2.2.17

Matte side(Rz)

um

1.5-2.0

optical method

Tensile Strength

R.T.(23°C)

Mpa

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Peel Strength(FR-4)

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650 2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Pinholes & porosity

Numbers

No

IPC-TM-650 2.1.2

Anti-oxidization

R.T.(23°C)

Days

90

 

H.T.(200°C)

Minutes

40

 

Standard Width,1295(±1)mm, Width range: 200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Factory making Ra Ed Copper Foil - Hyper Very Low Profile Copper Foil For High Speed Transmission – JM detail pictures


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That has a sound business credit history, outstanding after-sales service and modern producing facilities, we have earned an superb popularity amid our buyers across the planet for Factory making Ra Ed Copper Foil - Hyper Very Low Profile Copper Foil For High Speed Transmission – JM , The product will supply to all over the world, such as: Netherlands, Istanbul, Bandung, Certainly, competitive price, suitable package and timely delivery will be assured as per customers' demands. We sincerely hope to build business relationship with you on the basis of mutual benefit and profit in the very near future. Warmly welcome to contact us and become our direct cooperators.
  • A nice supplier in this industry, after a detail and careful discussion, we reached a consensus agreement. Hope that we cooperate smoothly.
    5 Stars By Betty from Turkey - 2017.09.28 18:29
    This company can be well to meet our needs on product quantity and delivery time, so we always choose them when we have procurement requirements.
    5 Stars By Andy from Amsterdam - 2018.11.11 19:52
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