Factory making Ra Ed Copper Foil - Hyper Very Low Profile Copper Foil For High Speed Transmission – JM


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Factory making Ra Ed Copper Foil - Hyper Very Low Profile Copper Foil For High Speed Transmission – JM Detail:

JIMA Copper proprietary ultra low roughness treatment process ensures effective adhesion strength for low Dk film materials, for which adhesion strength is difficult to achieve, without sacrificing transmission properties. Due to the recrystallized base foil, it also offers superior bending characteristics for contributing to the next generation of flexible printed circuits.

Detail

● Thickness: 12um 18um 35um
● Standard Width: 1290mm, can be cutting as size request.
● Wooden box package
● ID: 76 mm, 152 mm
● Length: Customized
● Sample can be supply
● Lead time: 15-20days
● High precision cutting equipment cut copper foils according to width required by customers.
● Slitting Working Procedure: Conduct slitting, classification, inspection and package according to requirement for quality, width and weight of copper foils of customers.

Features

● Ultra -low profile, with high peel
● Strength and good etchability
● Low coarsening technology

Application

● High speed digital
● Base station/server
● PPO/PPE
● Use Low coarsening technology ,the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● High frequency transmission circuit / High Speed Transmission.

Typical Properties of Hyper Very Low Profile Copper Foil

Classification

Unit

Requirement

Test Method

Foil Designation

 

T

H

1

IPC-4562A

Nominal thickness

um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285± 10

IPC-TM-650 2.2.12

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

um

≤0.43

IPC-TM-650 2.2.17

Matte side(Rz)

um

1.5-2.0

optical method

Tensile Strength

R.T.(23°C)

Mpa

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Peel Strength(FR-4)

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650 2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Pinholes & porosity

Numbers

No

IPC-TM-650 2.1.2

Anti-oxidization

R.T.(23°C)

Days

90

 

H.T.(200°C)

Minutes

40

 

Standard Width,1295(±1)mm, Width range: 200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Factory making Ra Ed Copper Foil - Hyper Very Low Profile Copper Foil For High Speed Transmission – JM detail pictures


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With dependable high quality approach, great reputation and excellent customer support, the series of products and solutions produced by our firm are exported to lots of countries and regions for Factory making Ra Ed Copper Foil - Hyper Very Low Profile Copper Foil For High Speed Transmission – JM , The product will supply to all over the world, such as: Munich, Madras, Mauritius, Meanwhile, we're building up and consummating triangle market & strategic cooperation in order to achieve a multi-win trade supply chain to expand our market vertically and horizontally for a brighter prospects. development. Our philosophy is to create cost-effective products and solutions, promote perfect services, cooperate for long-term and mutual benefits, firm a in depth mode of excellent suppliers system and marketing agents, brand strategic cooperation sales system.
  • The company's products very well, we have purchased and cooperated many times, fair price and assured quality, in short, this is a trustworthy company!
    5 Stars By Alice from Mexico - 2017.05.21 12:31
    Factory equipment is advanced in the industry and the product is fine workmanship, moreover the price is very cheap, value for money!
    5 Stars By Rosemary from Cyprus - 2018.09.29 17:23
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