Factory making Ra Ed Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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We support our purchasers with ideal premium quality products and substantial level company. Becoming the specialist manufacturer in this sector, we've acquired rich practical working experience in producing and managing for Fpc Rolled Copper Foil, Copper Foil Hte, Hvlp Copper Foil, Winning customers' trust is definitely the gold key to our good results! If you are fascinated in our products, make sure you sense absolutely free to go to our web site or make contact with us.
Factory making Ra Ed Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Factory making Ra Ed Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

Factory making Ra Ed Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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We now have our own gross sales team, style and design workforce, technical crew, QC workforce and package group. We now have strict quality manage procedures for each system. Also, all of our workers are experienced in printing industry for Factory making Ra Ed Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: South Africa, Bulgaria, Poland, Excellent quality, competitive price, punctual delivery and dependable service can be guaranteed. For further inquires please do not hesitate to contact us. Thank you - Your support continuously inspires us.
  • Managers are visionary, they have the idea of "mutual benefits, continuous improvement and innovation", we have a pleasant conversation and Cooperation.
    5 Stars By Chloe from Mexico - 2018.06.18 17:25
    The company has rich resources, advanced machinery, experienced workers and excellent services, hope you keep improving and perfecting your products and service, wish you better!
    5 Stars By Ella from Frankfurt - 2017.11.20 15:58
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