Factory source 1 Micron Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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Our business puts emphasis over the administration, the introduction of talented staff, plus the construction of team building, attempting hard to boost the standard and liability consciousness of personnel customers. Our corporation successfully attained IS9001 Certification and European CE Certification of Pcb 6 Oz Copper Foil, Electrolytic Copper Foil Manufacturers, Ed Nickel Foil, With the tenet of "faith-based, customer first", we welcome clients to call or e-mail us for cooperation.
Factory source 1 Micron Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Factory source 1 Micron Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

Factory source 1 Micron Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


Related Product Guide:

We hold strengthening and perfecting our items and repair. At the same time, we get the job done actively to do research and progress for Factory source 1 Micron Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Sri Lanka, Mexico, Karachi, We adopt advanced production equipment and technology, and perfect testing equipment and methods to ensure our product quality. With our high-level talents, scientific management, excellent teams, and attentive service, our merchandise are favored by domestic and foreign customers. With your support, we'll build a better tomorrow!
  • The accounts manager made a detailed introduction about the product, so that we have a comprehensive understanding of the product, and ultimately we decided to cooperate.
    5 Stars By Hilda from Egypt - 2017.10.25 15:53
    It's really lucky to find such a professional and responsible manufacturer, the product quality is good and delivery is timely, very nice.
    5 Stars By Sally from Swiss - 2018.06.12 16:22
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