Factory source 1 Micron Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM


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Together with the "Client-Oriented" enterprise philosophy, a arduous good quality control technique, sophisticated producing equipment and a sturdy R&D staff, we generally offer superior quality merchandise, superb solutions and aggressive rates for Copper Foil 0.0005, Copper Foils For Flexible Circuit, Reverse Treated Copper Foil, Living by good quality, enhancement by credit history is our eternal pursuit, We firmly feel that soon after your visit we will become long-term associates.
Factory source 1 Micron Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8

Pinholes & Porosity Number

No

IPC-TM-650 2.1.2

Anti-oxidization R.T.(23°C) Days

180

H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Factory source 1 Micron Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM detail pictures


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It adheres for the tenet "Honest, industrious, enterprising, innovative" to develop new products and solutions continuously. It regards shoppers, success as its individual success. Let us produce prosperous future hand in hand for Factory source 1 Micron Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: Ghana, Pakistan, Norway, Our company promises: reasonable prices, short production time and satisfactory after-sales service, we also welcome you to visit our factory at any time you want. Wish we have a pleasant and long terms business together!!!
  • The goods we received and the sample sales staff display to us have the same quality, it is really a creditable manufacturer.
    5 Stars By Alan from Switzerland - 2017.08.18 11:04
    Speaking of this cooperation with the Chinese manufacturer, I just want to say"well dodne", we are very satisfied.
    5 Stars By Andrew from Lithuania - 2018.06.09 12:42
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