Factory source 1 Micron Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM
Factory source 1 Micron Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:
Detail
● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply
Features
This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.
● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black
Application
● 3layer FCCL
● EMI
Typical properties of Low Profile Copper Foil (LP -S-P/B)
Classification |
Unit |
Requirement |
Test Method |
||||||||
Nominal thickness |
Um |
12 |
18 |
25 |
35 |
50 |
70 |
105 |
IPC-4562A |
||
Area Weight |
g/m² |
107±5 |
153±7 |
225±8 |
285± 10 |
435±15 |
585± 20 |
870±30 |
IPC-TM-650 2.2.12.2 |
||
Purity |
% |
≥99.8 |
IPC-TM-650 2.3.15 |
||||||||
roughness |
Shiny side (Ra) |
սm |
≤0.43 |
IPC-TM-650 2.3.17 |
|||||||
Matte side(Rz) |
um |
≤4.5 |
≤5.0 |
≤6.0 |
≤7.0 |
≤8.0 |
≤12 |
≤14 |
|||
Tensile Strength |
R.T.(23°C) |
Mpa |
≥207 |
≥276 |
IPC-TM-650 2.4.18 |
||||||
H.T.(180°C) |
≥138 |
||||||||||
Elongation |
R.T.(23°C) |
% |
≥4 |
≥4 |
≥5 |
≥8 |
≥10 |
≥12 |
≥12 |
IPC-TM-650 2.4.18 |
|
H.T.(180°C |
≥4 |
≥4 |
≥5 |
≥6 |
≥8 |
≥8 |
≥8 |
||||
Resistivity |
Ω.g/m² |
≤0.17 0 |
≤0.1 66 |
≤0.16 2 |
≤0.16 2 |
≤0.16 2 |
IPC-TM-650 2.5.14 |
||||
Peel Strength(FR-4) |
N/mm |
≥1.0 |
≥1.3 |
≥1.6 |
≥1.6 |
≥2.1 |
IPC-TM-650 2.4.8 |
||||
Pinholes & Porosity | Number |
No |
IPC-TM-650 2.1.2 |
||||||||
Anti-oxidization | R.T.(23°C) | Days |
180 |
||||||||
H.T.(200°C) | Minutes |
30 |
Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.
Product detail pictures:

Related Product Guide:
The corporation upholds the philosophy of "Be No.1 in excellent, be rooted on credit rating and trustworthiness for growth", will proceed to provide aged and new buyers from home and abroad whole-heatedly for Factory source 1 Micron Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: Lithuania, Senegal, Mauritius, We always adhere to follow the honesty, mutual benefit, common development, after years of development and the tireless efforts of all staff, now has perfect export system, diversified logistics solutions, thorough meet customer shipping, air transport, international express and logistics services. Elaborate one-stop sourcing platform for our customers!

This company conforms to the market requirement and joins in the market competition by its high quality product, this is an enterprise that have Chinese spirit.
