Factory wholesale Copper Foil Etching - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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Our organization promises all customers with the first-class products and solutions and the most satisfying post-sale service. We warmly welcome our regular and new clients to join us for 3 Oz Copper Foil-, Copper Foil 10 Micron, 2 Oz Copper Foil Thickness, Our merchandise are new and previous prospects consistent recognition and trust. We welcome new and outdated shoppers to contact us for long term small business relations, common advancement. Let's speeding within the dark!
Factory wholesale Copper Foil Etching - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Factory wholesale Copper Foil Etching - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

Factory wholesale Copper Foil Etching - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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abide by the contract", conforms to the market requirement, joins during the market competition by its superior quality also as provides extra comprehensive and exceptional service for consumers to let them turn into significant winner. The pursue of the business, is definitely the clients' gratification for Factory wholesale Copper Foil Etching - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Ukraine, Puerto Rico, Montpellier, If you are interested in any of our products and solutions or would like to discuss a custom order, remember to feel free to contact us. We are looking forward to forming successful business relationships with new clients around the world in the near future.
  • Goods just received, we are very satisfied, a very good supplier, hope to make persistent efforts to do better.
    5 Stars By Dora from Denmark - 2018.09.21 11:44
    The accounts manager made a detailed introduction about the product, so that we have a comprehensive understanding of the product, and ultimately we decided to cooperate.
    5 Stars By Atalanta from Nepal - 2017.08.18 11:04
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