High definition C11000 Copper - Low Low Profile Copper Foil (LP -S-P/B) – JM


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The purchaser fulfillment is our primary focus on. We uphold a consistent level of professionalism, high quality, credibility and service for Copper Foil For Printed Circuit Board, Teflon Laminate Copper Foil Pcb, Rolled Annealed Copper Foil, Hope we are able to produce a far more superb long term with you by our efforts from the foreseeable future.
High definition C11000 Copper - Low Low Profile Copper Foil (LP -S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8

Pinholes & Porosity Number

No

IPC-TM-650 2.1.2

Anti-oxidization R.T.(23°C) Days

180

H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

High definition C11000 Copper - Low Low Profile Copper Foil (LP -S-P/B) – JM detail pictures


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Our enterprise since its inception, usually regards product top quality as business life, repeatedly enhance manufacturing technology, make improvements to product excellent and continuously strengthen enterprise total high quality administration, in strict accordance with all the national standard ISO 9001:2000 for High definition C11000 Copper - Low Low Profile Copper Foil (LP -S-P/B) – JM , The product will supply to all over the world, such as: moldova, Marseille, Florence, Look forward to the future, we will focus more on the brand building and promotion . And in the process of our brand global strategic layout we welcome more and more partners join us, work together with us based on mutual benefit. Let's develop market by fully utilizing our comprehensive advantages and strive for building.
  • This manufacturers not only respected our choice and requirements, but also gave us a lot of good suggestions, ultimately, we successfully completed the procurement tasks.
    5 Stars By Monica from San Francisco - 2017.06.22 12:49
    The company account manager has a wealth of industry knowledge and experience, he could provide appropriate program according our needs and speak English fluently.
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