High Performance Insulated Copper Foil - Low Profile Copper Foil (LP -S-P/B) – JM
High Performance Insulated Copper Foil - Low Profile Copper Foil (LP -S-P/B) – JM Detail:
Detail
● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply
Features
This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.
● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black
Application
● 3layer FCCL
● EMI
Typical properties of Low Profile Copper Foil (LP -S-P/B)
|
Classification |
Unit |
Requirement |
Test Method |
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|
Nominal thickness |
Um |
12 |
18 |
25 |
35 |
50 |
70 |
105 |
IPC-4562A |
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|
Area Weight |
g/m² |
107±5 |
153±7 |
225±8 |
285± 10 |
435±15 |
585± 20 |
870±30 |
IPC-TM-650 2.2.12.2 |
||
|
Purity |
% |
≥99.8 |
IPC-TM-650 2.3.15 |
||||||||
|
roughness |
Shiny side (Ra) |
սm |
≤0.43 |
IPC-TM-650 2.3.17 |
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|
Matte side(Rz) |
um |
≤4.5 |
≤5.0 |
≤6.0 |
≤7.0 |
≤8.0 |
≤12 |
≤14 |
|||
|
Tensile Strength |
R.T.(23°C) |
Mpa |
≥207 |
≥276 |
IPC-TM-650 2.4.18 |
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|
H.T.(180°C) |
≥138 |
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|
Elongation |
R.T.(23°C) |
% |
≥4 |
≥4 |
≥5 |
≥8 |
≥10 |
≥12 |
≥12 |
IPC-TM-650 2.4.18 |
|
|
H.T.(180°C |
≥4 |
≥4 |
≥5 |
≥6 |
≥8 |
≥8 |
≥8 |
||||
|
Resistivity |
Ω.g/m² |
≤0.17 0 |
≤0.1 66 |
≤0.16 2 |
≤0.16 2 |
≤0.16 2 |
IPC-TM-650 2.5.14 |
||||
|
Peel Strength(FR-4) |
N/mm |
≥1.0 |
≥1.3 |
≥1.6 |
≥1.6 |
≥2.1 |
IPC-TM-650 2.4.8 |
||||
| Pinholes & Porosity | Number |
No |
IPC-TM-650 2.1.2 |
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| Anti-oxidization | R.T.(23°C) | Days |
180 |
||||||||
| H.T.(200°C) | Minutes |
30 |
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Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.
Product detail pictures:
Related Product Guide:
From the past few years, our firm absorbed and digested sophisticated technologies equally at home and abroad. Meanwhile, our organization staffs a group of experts devoted into the growth of High Performance Insulated Copper Foil - Low Profile Copper Foil (LP -S-P/B) – JM , The product will supply to all over the world, such as: Singapore, Rome, India, The company attaches great importance to product quality and service quality, based on the business philosophy "good with people, genuine to whole world, your satisfaction is our pursuit". we design products, According to customer's sample and requirements, to meet the needs of the market and offer different customers with personalized service. Our company warmly welcomes friends at home and abroad to visit, to discuss cooperation and seek common development!
By Camille from Singapore - 2017.03.28 12:22
The sales manager has a good English level and skilled professional knowledge, we have a good communication. He is a warm and cheerful man, we have a pleasant cooperation and we became very good friends in private.
By Elsie from UAE - 2017.10.25 15:53
