High reputation Copper Foil Black Back - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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Our company insists all along the quality policy of "product quality is base of enterprise survival; customer satisfaction is the staring point and ending of an enterprise; persistent improvement is eternal pursuit of staff" and the consistent purpose of "reputation first, customer first" for Copper Red Foils, Copper Foil Black Back, Foil Copper, We believe that in good quality more than quantity. Before export of the hair there is strict top quality control check during treatment as per international good quality standards.
High reputation Copper Foil Black Back - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

High reputation Copper Foil Black Back - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

High reputation Copper Foil Black Back - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


Related Product Guide:

Sticking to the belief of "Creating products of high quality and making friends with people from all over the world", we always put the interest of customers in the first place for High reputation Copper Foil Black Back - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Amsterdam, Austria, Finland, Should any of these items be of interest to you, please let us know. We'll be satisfied to give you a quotation upon receipt of one's detailed specifications. We have our personal experienced R&D enginners to meet any of one's requriements, We appear forward to receiving your enquires soon'and hope to have the opportunity to work together with you in the future. Welcome to check out our company.
  • We always believe that the details decides the company's product quality, in this respect, the company conform our requirements and the goods are meet our expectations.
    5 Stars By David Eagleson from Milan - 2018.12.11 14:13
    The product manager is a very hot and professional person, we have a pleasant conversation, and finally we reached a consensus agreement.
    5 Stars By Genevieve from Colombia - 2018.10.31 10:02
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