Hot New Products Very Low Profile Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


Product Detail

Product Tags

Related Video

Feedback (2)

Our enterprise since its inception, constantly regards product good quality as organization life, constantly improve production technology, strengthen merchandise high quality and continuously strengthen enterprise total good quality administration, in strict accordance with all the national standard ISO 9001:2000 for Copper Foil Korea, Rtf Copper Foil, Electrolytic Copper Foil Manufacturers, We sincerely welcome both equally international and domestic company associates, and hope to work along with you during the in close proximity to foreseeable future!
Hot New Products Very Low Profile Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Hot New Products Very Low Profile Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

Hot New Products Very Low Profile Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


Related Product Guide:

Our intention should be to fulfill our consumers by offering golden provider, superior price and superior quality for Hot New Products Very Low Profile Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Romania, USA, New York, As the world economic integration bringing challenges and opportunities to the xxx industry, our company , by carrying on our teamwork, quality first, innovation and mutual benefit, are confident enough to provide our clients sincerely with qualified products, competitive price and great service, and to build a brighter future under the spirit of higher, faster, stronger with our friends together by carrying on our discipline.
  • We have been engaged in this industry for many years, we appreciate the work attitude and production capacity of the company, this is a reputable and professional manufacturer.
    5 Stars By David Eagleson from Paris - 2017.04.28 15:45
    This is the first business after our company establish, products and services are very satisfying, we have a good start, we hope to cooperate continuous in the future!
    5 Stars By Martha from Sweden - 2018.09.23 17:37
    Write your message here and send it to us