Hot New Products Very Low Profile Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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carry on to further improve, to guarantee merchandise high-quality in line with market and buyer standard necessities. Our organization has a top quality assurance procedure have already been established for 2 Oz Copper Foil, Wd Copper Shielding Foil, 8 Mil Copper Foil, We've been confident that there'll become a promising future and we hope we can have long lasting cooperation with consumers from all over the world.
Hot New Products Very Low Profile Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Hot New Products Very Low Profile Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

Hot New Products Very Low Profile Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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We know that we only thrive if we could guarantee our combined price tag competiveness and quality advantageous at the same time for Hot New Products Very Low Profile Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Germany, Dominica, Moscow, We hope we can establish long-term cooperation with all of the customers. And hope we can improve competitiveness and achieve the win-win situation together with the customers. We sincerely welcome the customers from all over the world to contact us for anything you need!
  • We have been engaged in this industry for many years, we appreciate the work attitude and production capacity of the company, this is a reputable and professional manufacturer.
    5 Stars By Candy from New Orleans - 2018.06.18 19:26
    This manufacturer can keep improving and perfecting products and service, it is in line with the rules of market competition, a competitive company.
    5 Stars By Carey from Cancun - 2018.10.31 10:02
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