Hot-selling Copper Cu - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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Our mission will be to become an innovative supplier of high-tech digital and communication devices by furnishing benefit added structure, world-class manufacturing, and service capabilities for Copper Rolls, Polished Copper Foil, Reverse Treated Copper Foil, We Sincerely welcome customers from all over the world to visit us, with our multifaceted cooperation and work together to develop new markets, create win-win brilliant future.
Hot-selling Copper Cu - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Hot-selling Copper Cu - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

Hot-selling Copper Cu - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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Our pursuit and firm aim should be to "Always fulfill our buyer requirements". We carry on to produce and structure top-quality excellent solutions for equally our aged and new consumers and accomplish a win-win prospect for our consumers as well as us for Hot-selling Copper Cu - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Washington, Ecuador, London, In order to meet our market demands, we have paied more attention to the quality of our products and services. Now we can meet customers' special requirements for special designs. We persistently develop our enterprise spirit "quality lives the enterprise, credit assures cooperation and keep the motto in our minds: customers first.
  • We are a small company that has just started, but we get the company leader's attention and gave us a lot of help. Hope we can make progress together!
    5 Stars By Queena from Zurich - 2017.05.21 12:31
    The supplier cooperation attitude is very good, encountered various problems, always willing to cooperate with us, to us as the real God.
    5 Stars By Paula from Turkey - 2017.12.09 14:01
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