Low MOQ for Pure Copper Foil - Low Profile Copper Foil (LP -S-P/B) – JM
Low MOQ for Pure Copper Foil - Low Profile Copper Foil (LP -S-P/B) – JM Detail:
Detail
● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply
Features
This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.
● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black
Application
● 3layer FCCL
● EMI
Typical properties of Low Profile Copper Foil (LP -S-P/B)
Classification |
Unit |
Requirement |
Test Method |
||||||||
Nominal thickness |
Um |
12 |
18 |
25 |
35 |
50 |
70 |
105 |
IPC-4562A |
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Area Weight |
g/m² |
107±5 |
153±7 |
225±8 |
285± 10 |
435±15 |
585± 20 |
870±30 |
IPC-TM-650 2.2.12.2 |
||
Purity |
% |
≥99.8 |
IPC-TM-650 2.3.15 |
||||||||
roughness |
Shiny side (Ra) |
սm |
≤0.43 |
IPC-TM-650 2.3.17 |
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Matte side(Rz) |
um |
≤4.5 |
≤5.0 |
≤6.0 |
≤7.0 |
≤8.0 |
≤12 |
≤14 |
|||
Tensile Strength |
R.T.(23°C) |
Mpa |
≥207 |
≥276 |
IPC-TM-650 2.4.18 |
||||||
H.T.(180°C) |
≥138 |
||||||||||
Elongation |
R.T.(23°C) |
% |
≥4 |
≥4 |
≥5 |
≥8 |
≥10 |
≥12 |
≥12 |
IPC-TM-650 2.4.18 |
|
H.T.(180°C |
≥4 |
≥4 |
≥5 |
≥6 |
≥8 |
≥8 |
≥8 |
||||
Resistivity |
Ω.g/m² |
≤0.17 0 |
≤0.1 66 |
≤0.16 2 |
≤0.16 2 |
≤0.16 2 |
IPC-TM-650 2.5.14 |
||||
Peel Strength(FR-4) |
N/mm |
≥1.0 |
≥1.3 |
≥1.6 |
≥1.6 |
≥2.1 |
IPC-TM-650 2.4.8 |
||||
Pinholes & Porosity | Number |
No |
IPC-TM-650 2.1.2 |
||||||||
Anti-oxidization | R.T.(23°C) | Days |
180 |
||||||||
H.T.(200°C) | Minutes |
30 |
Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.
Product detail pictures:
Related Product Guide:
We consistently execute our spirit of ''Innovation bringing progress, Highly-quality ensuring subsistence, Administration advertising and marketing gain, Credit history attracting buyers for Low MOQ for Pure Copper Foil - Low Profile Copper Foil (LP -S-P/B) – JM , The product will supply to all over the world, such as: Serbia, Barcelona, Switzerland, We will not only continuously introduce technical guidance of experts from both home and abroad, but also develop the new and advanced products constantly to satisfactorily meet the needs of our clients all over the world.
By Claire from Sevilla - 2018.06.26 19:27
The factory technical staff not only have high level of technology, their English level is also very good, this is a great help to technology communication.
By Deborah from Algeria - 2017.09.22 11:32