Low MOQ for Pure Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


Product Detail

Product Tags

Related Video

Feedback (2)

We insist on offering high-quality creation with superior business enterprise concept, honest revenue plus the greatest and fast service. it will bring you not only the high quality solution and huge profit, but essentially the most significant is usually to occupy the endless market for Rf Shielding Copper Foil, Copper Foil For Graphene Growth, Battery Foil, Our company is working through the procedure principle of "integrity-based, cooperation created, people oriented, win-win cooperation". We hope we can have a pleasant relationship with businessman from all around the earth.
Low MOQ for Pure Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Low MOQ for Pure Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

Low MOQ for Pure Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


Related Product Guide:

Our growth depends around the superior machines, exceptional talents and consistently strengthened technology forces for Low MOQ for Pure Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Colombia, Serbia, Provence, Our items have national accreditation requirements for qualified, high quality goods, affordable value, was welcomed by people today all over the world. Our products will continue to enhance within the order and look forward to cooperation with you, Should really any of these products and solutions be of curiosity to you, be sure to letus know. We are likely to be content to offer you a quotation up on receipt of your detailed needs.
  • This is a very professional wholesaler, we always come to their company for procurement, good quality and cheap.
    5 Stars By Cindy from Milan - 2017.08.18 11:04
    On this website, product categories is clear and rich, I can find the product I want very quickly and easily, this is really very good!
    5 Stars By Flora from Mexico - 2018.06.09 12:42
    Write your message here and send it to us