Low MOQ for Pure Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM

Product Detail

Product Tags

Feedback (2)

Fast and superior quotations, informed advisers to help you choose the correct merchandise that suits all your requirements, a short generation time, responsible quality control and different services for paying and shipping affairs for Copper Foil Ipc-4562, 1 Oz Copper Foil, Copper Manufacturers, Welcomes all abroad close friends and retailers to ascertain collaboration with us. We are going to give you with genuine, high-quality and successful company to satisfy your requirements.

Low MOQ for Pure Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification		Unit	Test Method			Test Method
Nominal thickness		Um	12	18	35	IPC-4562A
Area Weight		g/m²	107±5	153±7	285±10	IPC-TM-650 2.2.12.2
Purity		%	≥99.8			IPC-TM-650 2.3.15
Roughness	Shiny side (Ra)	սm	≤0.43	≤0.43	≤0.43	IPC-TM-650 2.3.17
Roughness	Matte side(Rz)	um	1.5-2.0	1.5-2.0	1.5-2.0
Tensile Strength	R.T.(23°C)	Mpa	≥300	≥300	≥300	IPC-TM-650 2.4.18
Tensile Strength	H.T.(180°C)	Mpa	≥180	≥180	≥180
Elongation	R.T.(23°C)	%	≥5	≥6	≥8	IPC-TM-650 2.4.18
Elongation	H.T.(180°C)	%	≥6	≥6	≥6
Pinholes & Porosity		Number	No			IPC-TM-650 2.1.2
Peel Strength		N/mm	≥0.6	≥0.8	≥1.0	IPC-TM-650 2.4.8
Peel Strength		Lbs/in	≥3.4	≥4.6	≥5.7	IPC-TM-650 2.4.8
Anti-oxidization	R.T.(23°C)	Days	90
Anti-oxidization	R.T.(200°C)	Minutes	40

Product detail pictures:

Related Product Guide:

We've been convinced that with joint efforts, the enterprise between us will bring us mutual benefits. We are able to assure you product or service quality and aggressive cost for Low MOQ for Pure Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Philippines, European, Lebanon, We believe that good business relationships will lead to mutual benefits and improvement for both parties. We have established long-term and successful cooperative relationships with many customers through their confidence in our customized services and integrity in doing business. We also enjoy a high reputation through our good performance. Better performance will be expected as our principle of integrity. Devotion and Steadiness will remain as ever.

1 Ounce Copper Foil