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Manufacturer for Reverse Treated Electrodeposited Copper Foil - Low Low Profile Copper Foil (LP -S-P/B) – JM

Manufacturer for Reverse Treated Electrodeposited Copper Foil - Low Low Profile Copper Foil (LP -S-P/B) – JM Featured Image
  • Manufacturer for Reverse Treated Electrodeposited Copper Foil - Low Low Profile Copper Foil (LP -S-P/B) – JM

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Manufacturer for Reverse Treated Electrodeposited Copper Foil - Low Low Profile Copper Foil (LP -S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8
Pinholes & Porosity Number

No

IPC-TM-650 2.1.2
Anti-oxidization R.T.(23°C) Days

180
H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1

Product detail pictures:

Manufacturer for Reverse Treated Electrodeposited Copper Foil - Low Low Profile Copper Foil (LP -S-P/B) – JM detail pictures

Related Product Guide:
We're going to dedicate ourselves to offering our esteemed shoppers with the most enthusiastically considerate solutions for Manufacturer for Reverse Treated Electrodeposited Copper Foil - Low Low Profile Copper Foil (LP -S-P/B) – JM , The product will supply to all over the world, such as: Uruguay, Provence, Mali, With the spirit of "high quality is our company's life; good reputation is our root", we sincerely hope to cooperate with customers from at home and abroad and hope to build a good relationship with you.
    • The company has a good reputation in this industry, and finally it tured out that choose them is a good choice.
    5 Stars By Julia from Swansea - 2017.08.28 16:02
    The factory can meet continuously developing economic and market needs, so that their products are widely recognized and trusted, and that's why we chose this company.
    5 Stars By Martin Tesch from United States - 2018.07.26 16:51
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