Manufacturer for Reverse Treated Electrodeposited Copper Foil - STD Standard Copper Foil – JM

The STD series is an IPC grade 1 copper foil intended for use as the outer layer of rigid boards. It is available in thicknesses ranging from a minimum 12 µm to a maximum ED copper foil thickness of 140 µm. This is the only ED copper foil available in the 105 µm and 140 µm thicknesses, making it ideal for boards designed as heat sinks or to conduct large electrical currents.

Features

● The treated foil in grey or red
● High peel strength
● Good etch ability
● Excellent adhesions to etching resist
● Excellent corrosion resistance

Typical application

● Phenolic
● Epoxy board
● CEM-1, CEM-3
● FR-4, FR-3
● This is our standard ED copper foil product with the longest history of use as an outer layer for rigid boards.

Surface quality
● 0 splices per coil
● Foil to have uniform colour, cleanliness and flatness
● No obvious pitting, pin holes or corrosion
● No surface defects such as creases, spots or lines
● Foil must be oil free and have no visible oil spots

Typical properties of High Temperature Elongation Copper Foil

Standard Width, 1295(±1)mm, Width range: 200-1340mm. May according to the customer request tailor.