Manufacturer for Reverse Treated Electrodeposited Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


Product Detail

Product Tags

Related Video

Feedback (2)

Our mission will be to become an innovative supplier of high-tech digital and communication devices by furnishing benefit added structure, world-class manufacturing, and service capabilities for 5 Mil Copper Foil, Copper Foil 0.02, Copper Red Foils, Teamwork is encouraged at all levels with regular campaigns. Our research group experiments on various developments during the industry for improvement within the solutions.
Manufacturer for Reverse Treated Electrodeposited Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Manufacturer for Reverse Treated Electrodeposited Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

Manufacturer for Reverse Treated Electrodeposited Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


Related Product Guide:

We constantly continually give you essentially the most conscientious client provider, plus the widest variety of designs and styles with finest materials. These initiatives include the availability of customized designs with speed and dispatch for Manufacturer for Reverse Treated Electrodeposited Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Vietnam, Saudi Arabia, Qatar, To let customers be more confident in us and get the most comfortable service, we run our company with honesty, sincerity and best quality . We firmly believe that it is our pleasure to help customers to run their business more successfully, and that our experienced advice and service can lead to more suitable choice for the customers.
  • Adhering to the business principle of mutual benefits, we have a happy and successful transaction, we think we will be the best business partner.
    5 Stars By Eden from Mauritius - 2018.10.31 10:02
    The factory workers have rich industry knowledge and operational experience, we learned a lot in working with them,we are extremely grateful that we can encount a good company has excellent wokers.
    5 Stars By Harriet from Germany - 2018.12.14 15:26
    Write your message here and send it to us