New Arrival China Electrodeposited Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM
New Arrival China Electrodeposited Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:
Detail
● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply
Features
This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.
● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black
Application
● 3layer FCCL
● EMI
Typical properties of Low Profile Copper Foil (LP -S-P/B)
|
Classification |
Unit |
Requirement |
Test Method |
||||||||
|
Nominal thickness |
Um |
12 |
18 |
25 |
35 |
50 |
70 |
105 |
IPC-4562A |
||
|
Area Weight |
g/m² |
107±5 |
153±7 |
225±8 |
285± 10 |
435±15 |
585± 20 |
870±30 |
IPC-TM-650 2.2.12.2 |
||
|
Purity |
% |
≥99.8 |
IPC-TM-650 2.3.15 |
||||||||
|
roughness |
Shiny side (Ra) |
սm |
≤0.43 |
IPC-TM-650 2.3.17 |
|||||||
|
Matte side(Rz) |
um |
≤4.5 |
≤5.0 |
≤6.0 |
≤7.0 |
≤8.0 |
≤12 |
≤14 |
|||
|
Tensile Strength |
R.T.(23°C) |
Mpa |
≥207 |
≥276 |
IPC-TM-650 2.4.18 |
||||||
|
H.T.(180°C) |
≥138 |
||||||||||
|
Elongation |
R.T.(23°C) |
% |
≥4 |
≥4 |
≥5 |
≥8 |
≥10 |
≥12 |
≥12 |
IPC-TM-650 2.4.18 |
|
|
H.T.(180°C |
≥4 |
≥4 |
≥5 |
≥6 |
≥8 |
≥8 |
≥8 |
||||
|
Resistivity |
Ω.g/m² |
≤0.17 0 |
≤0.1 66 |
≤0.16 2 |
≤0.16 2 |
≤0.16 2 |
IPC-TM-650 2.5.14 |
||||
|
Peel Strength(FR-4) |
N/mm |
≥1.0 |
≥1.3 |
≥1.6 |
≥1.6 |
≥2.1 |
IPC-TM-650 2.4.8 |
||||
| Pinholes & Porosity | Number |
No |
IPC-TM-650 2.1.2 |
||||||||
| Anti-oxidization | R.T.(23°C) | Days |
180 |
||||||||
| H.T.(200°C) | Minutes |
30 |
|||||||||
Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.
Product detail pictures:
Related Product Guide:
Our focus on should be to consolidate and enhance the quality and repair of present products, in the meantime constantly establish new products to meet unique customers' requires for New Arrival China Electrodeposited Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: Greek, Atlanta, Roman, We critically promise that we deliver all the customers with the best quality solutions, the most competitive prices and the most prompt delivery. We hope to win a resplendent future for customers and ourselves.
By Mary from Anguilla - 2017.04.28 15:45
The after-sale warranty service is timely and thoughtful, encounter problems can be resolved very quickly, we feel reliable and secure.
By Debby from Tajikistan - 2018.09.29 17:23
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