OEM Factory for Copper Foil 1 Mm - Very Low Profile Copper Foil (VLP-S-P/B) – JM


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The key to our success is "Good Product or service High quality, Reasonable Rate and Efficient Service" for Rolled Annealed Copper, Emi Shielding Copper Foil 140um, 1 Oz Copper Foil Thickness-, We always regard the technology and prospects as the uppermost. We always function hard to make terrific values for our prospects and give our customers far better products and solutions & solutions.
OEM Factory for Copper Foil 1 Mm - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8

Pinholes & Porosity Number

No

IPC-TM-650 2.1.2

Anti-oxidization R.T.(23°C) Days

180

H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

OEM Factory for Copper Foil 1 Mm - Very Low Profile Copper Foil (VLP-S-P/B) – JM detail pictures


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Our mission should be to turn out to be an innovative supplier of high-tech digital and communication devices by furnishing benefit added design and style, world-class manufacturing, and repair capabilities for OEM Factory for Copper Foil 1 Mm - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: America, Germany, Rwanda, You can let us know your idea to develop unique design for your own model to prevent too much similar parts in the market! We will offer our best service to satisfy all your needs! Please contact us right away!
  • Goods just received, we are very satisfied, a very good supplier, hope to make persistent efforts to do better.
    5 Stars By Ina from Spain - 2018.12.30 10:21
    It's really lucky to find such a professional and responsible manufacturer, the product quality is good and delivery is timely, very nice.
    5 Stars By Beatrice from Norwegian - 2017.04.28 15:45
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