OEM Manufacturer Copper Foil 1 Mil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


Product Detail

Product Tags

Related Video

Feedback (2)

Our company sticks into the basic principle of "Quality is definitely the life of the business, and status may be the soul of it" for Copper Foil 0.0005, C10200 Copper, 6n Copper Foil, We welcome shoppers, business enterprise associations and close friends from all sections with the globe to contact us and seek cooperation for mutual added benefits.
OEM Manufacturer Copper Foil 1 Mil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

OEM Manufacturer Copper Foil 1 Mil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

OEM Manufacturer Copper Foil 1 Mil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


Related Product Guide:

Our items are commonly identified and trusted by customers and may fulfill continuously switching economic and social wants of OEM Manufacturer Copper Foil 1 Mil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Algeria, Juventus, Croatia, we have 8 years experience of production and 5 years experience in trading with the customers all over the world. our clients mainly distributed in the North America, Africa and Eastern Europe. we can supply high quality products with the very competitive price.
  • We are really happy to find such a manufacturer that ensuring product quality at the same time the price is very cheap.
    5 Stars By Amelia from Brunei - 2017.02.14 13:19
    It's really lucky to find such a professional and responsible manufacturer, the product quality is good and delivery is timely, very nice.
    5 Stars By Bruno Cabrera from Grenada - 2018.06.12 16:22
    Write your message here and send it to us