OEM/ODM China Black Backed Copper Foil - Low Profile Copper Foil (LP -S-P/B) – JM


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Now we have highly developed devices. Our items are exported towards the USA, the UK and so on, enjoying a great popularity among the customers for Copper Foil For Printed Circuit Board, The Copper Coil, 1 Oz Copper Foil Thickness-, We welcome new and old customers from all walks of life to contact us for future business relationships and mutual success!
OEM/ODM China Black Backed Copper Foil - Low Profile Copper Foil (LP -S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8

Pinholes & Porosity Number

No

IPC-TM-650 2.1.2

Anti-oxidization R.T.(23°C) Days

180

H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

OEM/ODM China Black Backed Copper Foil - Low Profile Copper Foil (LP -S-P/B) – JM detail pictures


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No matter new consumer or outdated shopper, We believe in lengthy expression and trusted relationship for OEM/ODM China Black Backed Copper Foil - Low Profile Copper Foil (LP -S-P/B) – JM , The product will supply to all over the world, such as: Paris, The Swiss, Milan, With its rich manufacturing experience, high-quality products, and perfect after-sale service, the company has gained good reputation and has become one of the famous enterprise specialized in manufacturing series.We sincerely hope to establish business relation with you and pursue mutual benefit.
  • This is a reputable company, they have a high level of business management, good quality product and service, every cooperation is assured and delighted!
    5 Stars By Frances from Kyrgyzstan - 2017.04.08 14:55
    Reasonable price, good attitude of consultation, finally we achieve a win-win situation,a happy cooperation!
    5 Stars By Georgia from European - 2018.11.04 10:32
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