OEM/ODM Factory Copper Foil 0.005 - Hyper Very Low Profile Copper Foil For High speed digital – JM

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Our primary objective is always to offer our clients a serious and responsible small business relationship, offering personalized attention to all of them for Copper Foil Us, 2oz-6oz Copper Foil, Laminated Copper Foil, Our firm quickly grew in size and reputation because of its absolute dedication to superior quality manufacturing, substantial price of solutions and fantastic customer services.

OEM/ODM Factory Copper Foil 0.005 - Hyper Very Low Profile Copper Foil For High speed digital – JM Detail:

Features

● Ultra low profile with high peel strength and good etch ability
● Use Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit
● The treated foil is pink

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Hyper Very Low profile Copper Foil

Classification		Unit	Test Method			Test Method
Nominal thickness		Um	12	18	35	IPC-4562A
Area Weight		g/m²	107±5	153±7	285±10	IPC-TM-650 2.2.12.2
Purity		%	≥99.8			IPC-TM-650 2.3.15
Roughness	Shiny side (Ra)	սm	≤0.43	≤0.43	≤0.43	IPC-TM-650 2.3.17
Roughness	Matte side(Rz)	um	1.5-2.0	1.5-2.0	1.5-2.0
Tensile Strength	R.T.(23°C)	Mpa	≥300	≥300	≥300	IPC-TM-650 2.4.18
Tensile Strength	H.T.(180°C)	Mpa	≥180	≥180	≥180
Elongation	R.T.(23°C)	%	≥5	≥6	≥8	IPC-TM-650 2.4.18
Elongation	H.T.(180°C)	%	≥6	≥6	≥6
Pinholes & Porosity		Number	No			IPC-TM-650 2.1.2
Peel Strength		N/mm	≥0.6	≥0.8	≥1.0	IPC-TM-650 2.4.8
Peel Strength		Lbs/in	≥3.4	≥4.6	≥5.7	IPC-TM-650 2.4.8
Anti-oxidization	R.T.(23°C)	Days	90
Anti-oxidization	R.T.(200°C)	Minutes	40

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