OEM/ODM Factory Copper Foil 0.005 - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


Product Detail

Product Tags

Related Video

Feedback (2)

Our enterprise insists all along the standard policy of "product high-quality is base of business survival; client satisfaction could be the staring point and ending of an business; persistent improvement is eternal pursuit of staff" as well as consistent purpose of "reputation first, client first" for Phone Copper Foil, Hvlp Copper Foil, Fpc Rolled Copper Foil, Currently, we are looking forward to even greater cooperation with overseas customers based on mutual benefits. Please feel free to contact us for more details.
OEM/ODM Factory Copper Foil 0.005 - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

OEM/ODM Factory Copper Foil 0.005 - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

OEM/ODM Factory Copper Foil 0.005 - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


Related Product Guide:

We offer great strength in quality and development,merchandising,sales and marketing and operation for OEM/ODM Factory Copper Foil 0.005 - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Philippines, Belgium, UK, All styles appear on our website are for customizing. We meet up to personal requirements with all products of your very own styles. Our concept is to help presenting the confidence of each buyers with the offering of our most sincere service, and the right product.
  • We have been engaged in this industry for many years, we appreciate the work attitude and production capacity of the company, this is a reputable and professional manufacturer.
    5 Stars By Octavia from Oman - 2018.02.21 12:14
    Customer service staff and sales man are very patience and they all good at English, product's arrival is also very timely, a good supplier.
    5 Stars By Anna from Finland - 2018.11.02 11:11
    Write your message here and send it to us