OEM/ODM Manufacturer Copper Foil 0.0005 - Low Profile Copper Foil (LP -S-P/B) – JM


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We depend on sturdy technical force and continually create sophisticated technologies to meet the demand of 3 Mil Copper Foil, Rf Shielding Foil, Carbon Coated Copper Foil, Our tenet is "Reasonable prices, efficient production time and best service" We hope to cooperate with more customers for mutual development and benefits.
OEM/ODM Manufacturer Copper Foil 0.0005 - Low Profile Copper Foil (LP -S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8

Pinholes & Porosity Number

No

IPC-TM-650 2.1.2

Anti-oxidization R.T.(23°C) Days

180

H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

OEM/ODM Manufacturer Copper Foil 0.0005 - Low Profile Copper Foil (LP -S-P/B) – JM detail pictures


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Reliable good quality and very good credit standing are our principles, which will help us at a top-ranking position. Adhering to your tenet of "quality 1st, purchaser supreme" for OEM/ODM Manufacturer Copper Foil 0.0005 - Low Profile Copper Foil (LP -S-P/B) – JM , The product will supply to all over the world, such as: Hanover, Sao Paulo, Frankfurt, Customer satisfaction is our first goal. Our mission is to pursue the superlative quality, making continual progress. We sincerely welcome you to make progress hand in hand with us, and construct a prosperous future together.
  • The accounts manager made a detailed introduction about the product, so that we have a comprehensive understanding of the product, and ultimately we decided to cooperate.
    5 Stars By Andrew from Tajikistan - 2018.09.29 13:24
    Perfect services, quality products and competitive prices, we have work many times, every time is delighted, wish continue to maintain!
    5 Stars By Eric from Zambia - 2017.11.01 17:04
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