One of Hottest for Copper Foil Insulation - Hyper Very Low Profile Copper Foil For High speed digital – JM

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One of Hottest for Copper Foil Insulation - Hyper Very Low Profile Copper Foil For High speed digital – JM Detail:

Features

● Ultra low profile with high peel strength and good etch ability
● Use Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit
● The treated foil is pink

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Hyper Very Low profile Copper Foil

Classification		Unit	Test Method			Test Method
Nominal thickness		Um	12	18	35	IPC-4562A
Area Weight		g/m²	107±5	153±7	285±10	IPC-TM-650 2.2.12.2
Purity		%	≥99.8			IPC-TM-650 2.3.15
Roughness	Shiny side (Ra)	սm	≤0.43	≤0.43	≤0.43	IPC-TM-650 2.3.17
Roughness	Matte side(Rz)	um	1.5-2.0	1.5-2.0	1.5-2.0
Tensile Strength	R.T.(23°C)	Mpa	≥300	≥300	≥300	IPC-TM-650 2.4.18
Tensile Strength	H.T.(180°C)	Mpa	≥180	≥180	≥180
Elongation	R.T.(23°C)	%	≥5	≥6	≥8	IPC-TM-650 2.4.18
Elongation	H.T.(180°C)	%	≥6	≥6	≥6
Pinholes & Porosity		Number	No			IPC-TM-650 2.1.2
Peel Strength		N/mm	≥0.6	≥0.8	≥1.0	IPC-TM-650 2.4.8
Peel Strength		Lbs/in	≥3.4	≥4.6	≥5.7	IPC-TM-650 2.4.8
Anti-oxidization	R.T.(23°C)	Days	90
Anti-oxidization	R.T.(200°C)	Minutes	40

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Our firm promises all consumers with the first-class products as well as most satisfying post-sale services. We warmly welcome our regular and new consumers to join us for One of Hottest for Copper Foil Insulation - Hyper Very Low Profile Copper Foil For High speed digital – JM , The product will supply to all over the world, such as: Slovak Republic, Japan, Miami, To work with an excellent products manufacturer, our company is your best choice. Warmly welcome you and opening up the boundaries of communication. We are the ideal partner of your business development and look forward to your sincere cooperation.

1 Ounce Copper Foil