One of Hottest for Copper Foil Insulation - Hyper Very Low Profile Copper Foil For High Speed Transmission – JM


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One of Hottest for Copper Foil Insulation - Hyper Very Low Profile Copper Foil For High Speed Transmission – JM Detail:

JIMA Copper proprietary ultra low roughness treatment process ensures effective adhesion strength for low Dk film materials, for which adhesion strength is difficult to achieve, without sacrificing transmission properties. Due to the recrystallized base foil, it also offers superior bending characteristics for contributing to the next generation of flexible printed circuits.

Detail

● Thickness: 12um 18um 35um
● Standard Width: 1290mm, can be cutting as size request.
● Wooden box package
● ID: 76 mm, 152 mm
● Length: Customized
● Sample can be supply
● Lead time: 15-20days
● High precision cutting equipment cut copper foils according to width required by customers.
● Slitting Working Procedure: Conduct slitting, classification, inspection and package according to requirement for quality, width and weight of copper foils of customers.

Features

● Ultra -low profile, with high peel
● Strength and good etchability
● Low coarsening technology

Application

● High speed digital
● Base station/server
● PPO/PPE
● Use Low coarsening technology ,the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● High frequency transmission circuit / High Speed Transmission.

Typical Properties of Hyper Very Low Profile Copper Foil

Classification

Unit

Requirement

Test Method

Foil Designation

 

T

H

1

IPC-4562A

Nominal thickness

um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285± 10

IPC-TM-650 2.2.12

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

um

≤0.43

IPC-TM-650 2.2.17

Matte side(Rz)

um

1.5-2.0

optical method

Tensile Strength

R.T.(23°C)

Mpa

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Peel Strength(FR-4)

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650 2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Pinholes & porosity

Numbers

No

IPC-TM-650 2.1.2

Anti-oxidization

R.T.(23°C)

Days

90

 

H.T.(200°C)

Minutes

40

 

Standard Width,1295(±1)mm, Width range: 200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1


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One of Hottest for Copper Foil Insulation - Hyper Very Low Profile Copper Foil For High Speed Transmission – JM detail pictures


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With advanced technologies and facilities, strict quality control, reasonable price, superior service and close co-operation with customers, we are devoted to providing the best value for our customers for One of Hottest for Copper Foil Insulation - Hyper Very Low Profile Copper Foil For High Speed Transmission – JM , The product will supply to all over the world, such as: Netherlands, Plymouth, Berlin, We adhere to client 1st, top quality 1st, continuous improvement, mutual advantage and win-win principles. When cooperation together with the customer, we provide shoppers with the highest high-quality of service. Established good business relations using the Zimbabwe buyer inside the business, we've got established own brand and reputation. At the identical time, wholeheartedly welcome new and old prospects to our company to go to and negotiate small business.
  • The sales manager has a good English level and skilled professional knowledge, we have a good communication. He is a warm and cheerful man, we have a pleasant cooperation and we became very good friends in private.
    5 Stars By Miguel from Pakistan - 2018.06.19 10:42
    In our cooperated wholesalers, this company has the best quality and reasonable price, they are our first choice.
    5 Stars By Odelette from Brisbane - 2018.06.21 17:11
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