One of Hottest for Copper Foil Insulation - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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With dependable high-quality method, fantastic standing and ideal purchaser assistance, the series of products produced by our firm are exported to many countries and regions for Copper Foil Korea, C1100 Copper, Foil Shield, our merchandise have superior popularity from the whole world as its most competive cost and our most advantage of after-sale assistance for the clients。
One of Hottest for Copper Foil Insulation - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

One of Hottest for Copper Foil Insulation - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

One of Hottest for Copper Foil Insulation - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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With this motto in mind, we've got develop into amongst one of the most technologically innovative, cost-efficient, and price-competitive manufacturers for One of Hottest for Copper Foil Insulation - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Lyon, Mauritania, Estonia, High output volume, top quality, timely delivery and your satisfaction are guaranteed. We welcome all inquiries and comments. We also offer agency service---that act as the agent in china for our customers. If you are interested in any of our products or have an OEM order to fulfill, please feel free to contact us now. Working with us will save you money and time.
  • A good manufacturers, we have cooperated twice, good quality and good service attitude.
    5 Stars By Eudora from Bangladesh - 2018.10.31 10:02
    The company has rich resources, advanced machinery, experienced workers and excellent services, hope you keep improving and perfecting your products and service, wish you better!
    5 Stars By Lillian from Cambodia - 2018.11.02 11:11
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