One of Hottest for Copper Foil Insulation - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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We've one of the most advanced generation tools, experienced and qualified engineers and workers, recognized good quality manage systems and a friendly skilled product sales workforce pre/after-sales support for 5 Micron Copper Foil, Copper Foil Capacitor, Copper Foil Black Back, We are sincerely looking forward to cooperate with buyers all around the world. We imagine we will satisfy you. We also warmly welcome shoppers to visit our organization and purchase our merchandise.
One of Hottest for Copper Foil Insulation - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

One of Hottest for Copper Foil Insulation - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

One of Hottest for Copper Foil Insulation - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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go on to boost, to be certain item quality in line with market and buyer standard demands. Our firm has a excellent assurance procedure happen to be established for One of Hottest for Copper Foil Insulation - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Ghana, Paraguay, Czech republic, Our production have been exported to more than 30 countries and regions as first hand source with lowest price. We sincerely welcome customers from both at home and abroad to come to negotiate business with us.
  • This is the first business after our company establish, products and services are very satisfying, we have a good start, we hope to cooperate continuous in the future!
    5 Stars By Prima from Milan - 2018.04.25 16:46
    The manufacturer gave us a big discount under the premise of ensuring the quality of products, thank you very much, we will select this company again.
    5 Stars By Abigail from Bandung - 2018.12.11 14:13
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