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One of Hottest for Copper Foil Insulation - Very Low Profile Copper Foil (VLP-S-P/B) – JM

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  • One of Hottest for Copper Foil Insulation - Very Low Profile Copper Foil (VLP-S-P/B) – JM

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We also offer product sourcing and flight consolidation services. We have our own factory and sourcing office. We can provide you with almost every type of product related to our product range for Copper Red Foils, Copper Foil For Graphene Growth, C11000 Copper Foil, Honesty is our principle, skilled procedure is our perform, service is our target, and customers' satisfaction is our long term!
One of Hottest for Copper Foil Insulation - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8
Pinholes & Porosity Number

No

IPC-TM-650 2.1.2
Anti-oxidization R.T.(23°C) Days

180
H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1

Product detail pictures:

One of Hottest for Copper Foil Insulation - Very Low Profile Copper Foil (VLP-S-P/B) – JM detail pictures

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Our advantages are reduced prices,dynamic product sales workforce,specialized QC,solid factories,superior quality services for One of Hottest for Copper Foil Insulation - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: Sevilla, Malaysia, Albania, We guarantee that our company will try our best to reduce customer purchase cost , shorten the period of purchase , stable products quality , increase customers' satisfaction and achieve win-win situation .
    • We are old friends, the company's product quality has been always very good and this time the price is also very cheap.
    5 Stars By Gill from Swaziland - 2018.03.03 13:09
    This is the first business after our company establish, products and services are very satisfying, we have a good start, we hope to cooperate continuous in the future!
    5 Stars By Louis from Indonesia - 2017.11.11 11:41
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