One of Hottest for Copper Foil Insulation - Very Low Profile Copper Foil (VLP-S-P/B) – JM


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We believe in: Innovation is our soul and spirit. Quality is our life. Shopper need is our God for Copper Foil 0.25mm, 1290mm Wide 105um / 3oz Thickness, 2 Oz Copper Foil Thickness, We warmly welcome you to build cooperation and generate a brilliant long term together with us.
One of Hottest for Copper Foil Insulation - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8

Pinholes & Porosity Number

No

IPC-TM-650 2.1.2

Anti-oxidization R.T.(23°C) Days

180

H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1


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One of Hottest for Copper Foil Insulation - Very Low Profile Copper Foil (VLP-S-P/B) – JM detail pictures


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Persisting in "High quality, Prompt Delivery, Aggressive Price", we have established long-term cooperation with clientele from both equally overseas and domestically and get new and old clients' higher comments for One of Hottest for Copper Foil Insulation - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: Turin, Muscat, Costa rica, we are sincerely hope to establish one good long term business relationship with your esteemed company thought this opportunity, based on equal, mutual beneficial and win win business from now till the future.
  • The customer service staff is very patient and has a positive and progressive attitude to our interest, so that we can have a comprehensive understanding of the product and finally we reached an agreement, thanks!
    5 Stars By Austin Helman from Poland - 2018.06.26 19:27
    High Quality, High Efficiency, Creative and Integrity, worth having long-term cooperation! Looking forward to the future cooperation!
    5 Stars By Patricia from Tunisia - 2017.12.31 14:53
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