professional factory for Copper Foil For Supercapacitors - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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We now have our individual sales group, layout team, technical team, QC crew and package group. Now we have strict high-quality control procedures for each procedure. Also, all of our workers are experienced in printing discipline for Thin Copper Foil, Copper Foil 1 Oz, Ra Ed Copper Foil, At our firm with good quality initially as our motto, we manufacture merchandise that are entirely made in Japan, from materials procurement to processing. This enables them for being used with confident peace of mind.
professional factory for Copper Foil For Supercapacitors - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

professional factory for Copper Foil For Supercapacitors - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

professional factory for Copper Foil For Supercapacitors - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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All we do is usually connected with our tenet " Consumer initial, Rely on 1st, devoting around the food stuff packaging and environmental safety for professional factory for Copper Foil For Supercapacitors - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Latvia, Latvia, Monaco, Merchandise have been exported to Asia, Mid-east,European and Germany market. Our company has constantly been able to update the items performance and safety to meet the markets and strive to be top A on stable quality and sincere service. If you have the honor to do business with our company. we'll undoubtedly do our very best to support your business in China.
  • The customer service reprersentative explained very detailed, service attitude is very good, reply is very timely and comprehensive, a happy communication! We hope to have a opportunity to cooperate.
    5 Stars By Eunice from Portland - 2017.10.25 15:53
    The factory technical staff gave us a lot of good advice in the cooperation process, this is very good, we are very grateful.
    5 Stars By Phoenix from Namibia - 2017.05.02 11:33
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