Reasonable price for Copper Foil For Graphene Growth - Ultra Low Profile Copper Foil For 5G High frequency Board – JM

Product Detail

Product Tags

Feedback (2)

carry on to further improve, to guarantee merchandise high-quality in line with market and buyer standard necessities. Our organization has a top quality assurance procedure have already been established for Shielding Copper Foil, Hte Copper Foil Pcb, 1 Oz Copper Foil Thickness-, Your support is our eternal power! Warmly welcome customers at home and abroad to visit our company.

Reasonable price for Copper Foil For Graphene Growth - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification		Unit	Test Method			Test Method
Nominal thickness		Um	12	18	35	IPC-4562A
Area Weight		g/m²	107±5	153±7	285±10	IPC-TM-650 2.2.12.2
Purity		%	≥99.8			IPC-TM-650 2.3.15
Roughness	Shiny side (Ra)	սm	≤0.43	≤0.43	≤0.43	IPC-TM-650 2.3.17
Roughness	Matte side(Rz)	um	1.5-2.0	1.5-2.0	1.5-2.0
Tensile Strength	R.T.(23°C)	Mpa	≥300	≥300	≥300	IPC-TM-650 2.4.18
Tensile Strength	H.T.(180°C)	Mpa	≥180	≥180	≥180
Elongation	R.T.(23°C)	%	≥5	≥6	≥8	IPC-TM-650 2.4.18
Elongation	H.T.(180°C)	%	≥6	≥6	≥6
Pinholes & Porosity		Number	No			IPC-TM-650 2.1.2
Peel Strength		N/mm	≥0.6	≥0.8	≥1.0	IPC-TM-650 2.4.8
Peel Strength		Lbs/in	≥3.4	≥4.6	≥5.7	IPC-TM-650 2.4.8
Anti-oxidization	R.T.(23°C)	Days	90
Anti-oxidization	R.T.(200°C)	Minutes	40

Product detail pictures:

Related Product Guide:

Our concentrate on is always to consolidate and enhance the excellent and service of present solutions, in the meantime regularly develop new products to meet distinctive customers' demands for Reasonable price for Copper Foil For Graphene Growth - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Egypt, Canada, Bahrain, We welcome you to visit our company, factory and our showroom displayed various products that will meet your expectation, meanwhile, it is convenient to visit our website, our sales staff will try their efforts to provide you the best service. If you need more information, please do not hesitate to contact us by E-mail or telephone.

9 Micron Copper Foil