Renewable Design for 5 Mil Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM


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Our enterprise since its inception, constantly regards product good quality as organization life, constantly improve production technology, strengthen merchandise high quality and continuously strengthen enterprise total good quality administration, in strict accordance with all the national standard ISO 9001:2000 for Copper Foil Rolls, Ipc-4562 Copper Foilcopper Foil Shielding, 2 Oz Copper Foil, We've been glad that we have been steadily escalating using the energetic and long lasting assist of our pleased shoppers!
Renewable Design for 5 Mil Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

Renewable Design for 5 Mil Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures

Renewable Design for 5 Mil Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board  – JM detail pictures


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We're commitment to offer you the aggressive cost ,superb products and solutions top quality, too as fast delivery for Renewable Design for 5 Mil Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Pakistan, United Arab emirates, Greek, Our items are widely recognized and trusted by users and can meet continuously changing economic and social needs. We welcome new and old customers from all walks of life to contact us for future business relationships and mutual success!
  • We have worked with many companies, but this time is the best,detailed explanation, timely delivery and quality qualified, nice!
    5 Stars By Ryan from Moscow - 2017.01.28 18:53
    We have been cooperated with this company for many years, the company always ensure timely delivery ,good quality and correct number, we are good partners.
    5 Stars By Anna from Palestine - 2017.09.26 12:12
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