Trending Products 5 Micron Copper Foil - Hyper Very Low Profile Copper Foil For High Speed Transmission – JM


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Trending Products 5 Micron Copper Foil - Hyper Very Low Profile Copper Foil For High Speed Transmission – JM Detail:

JIMA Copper proprietary ultra low roughness treatment process ensures effective adhesion strength for low Dk film materials, for which adhesion strength is difficult to achieve, without sacrificing transmission properties. Due to the recrystallized base foil, it also offers superior bending characteristics for contributing to the next generation of flexible printed circuits.

Detail

● Thickness: 12um 18um 35um
● Standard Width: 1290mm, can be cutting as size request.
● Wooden box package
● ID: 76 mm, 152 mm
● Length: Customized
● Sample can be supply
● Lead time: 15-20days
● High precision cutting equipment cut copper foils according to width required by customers.
● Slitting Working Procedure: Conduct slitting, classification, inspection and package according to requirement for quality, width and weight of copper foils of customers.

Features

● Ultra -low profile, with high peel
● Strength and good etchability
● Low coarsening technology

Application

● High speed digital
● Base station/server
● PPO/PPE
● Use Low coarsening technology ,the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● High frequency transmission circuit / High Speed Transmission.

Typical Properties of Hyper Very Low Profile Copper Foil

Classification

Unit

Requirement

Test Method

Foil Designation

 

T

H

1

IPC-4562A

Nominal thickness

um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285± 10

IPC-TM-650 2.2.12

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

um

≤0.43

IPC-TM-650 2.2.17

Matte side(Rz)

um

1.5-2.0

optical method

Tensile Strength

R.T.(23°C)

Mpa

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Peel Strength(FR-4)

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650 2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Pinholes & porosity

Numbers

No

IPC-TM-650 2.1.2

Anti-oxidization

R.T.(23°C)

Days

90

 

H.T.(200°C)

Minutes

40

 

Standard Width,1295(±1)mm, Width range: 200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1


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Trending Products 5 Micron Copper Foil - Hyper Very Low Profile Copper Foil For High Speed Transmission – JM detail pictures


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We insist on offering good quality generation with very good business enterprise concept, honest income as well as best and fast assistance. it will bring you not only the premium quality product or service and huge profit, but probably the most significant is usually to occupy the endless market for Trending Products 5 Micron Copper Foil - Hyper Very Low Profile Copper Foil For High Speed Transmission – JM , The product will supply to all over the world, such as: Roman, Israel, Manchester, Our company absorbs new ideas, strict quality control, a full range of service tracking, and adhere to make high-quality solutions. Our business aims to "honest and trustworthy, favorable price, customer first", so we won the trust of the majority of customers! If you are interested in our items and services, please do not hesitate to contact us!
  • Customer service staff and sales man are very patience and they all good at English, product's arrival is also very timely, a good supplier.
    5 Stars By Mag from Malta - 2018.12.25 12:43
    The sales person is professional and responsible, warm and polite, we had a pleasant conversation and no language barriers on communication.
    5 Stars By Betsy from Kuwait - 2017.01.28 18:53
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