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Well-designed Vlp-2 Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM

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  • Well-designed Vlp-2 Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM
  • Well-designed Vlp-2 Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM

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Our commission would be to serve our customers and clientele with very best excellent and aggressive portable digital products for The Grade 3 Copper Foil, Wd Copper Shielding Foil, Grade 3 Copper Foil, We are willing to give you the best suggestions on the designs of your orders in a professional way if you need. In the meantime, we keep on developing new technologies and creating new designs so as to make you ahead in the line of this business.
Well-designed Vlp-2 Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM Detail:

The raw foil, which has a glossy surface with ultra low roughness on both sides, is treated withJIMA Copper proprietary micro-roughening process  to achieve high anchoring performance and also ultra low roughness. It offers high performance in a wide range of fields, from rigid printed circuit boards that prioritize transmission properties and fabrication of fine pattern to flexible printed circuits that prioritize transparency.

Features

● Ultra low profile with high peel strength and good etch ability.
● Hyper Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit.
● The treated foil is pink.

Typical application

● High frequency transmission circuit
● Base station/Server
● High speed digital
● PPO/PPE

Typical Properties of Ultra Low Profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

R.T.(200°C)

Minutes

40

5G High frequency Board Ultra Low Profile Copper Foil1

Product detail pictures:

Well-designed Vlp-2 Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM detail pictures

Well-designed Vlp-2 Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM detail pictures

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It truly is our responsibility to fulfill your requirements and successfully provide you. Your fulfillment is our best reward. We're seeking forward in your check out for joint development for Well-designed Vlp-2 Copper Foil - Ultra Low Profile Copper Foil For 5G High frequency Board – JM , The product will supply to all over the world, such as: Bahamas, Luxembourg, Madrid, If you are interested in any of our products or would like to discuss a custom order, please feel free to contact us. We are looking forward to forming successful business relationships with new clients around the world in the near future.
    • Problems can be quickly and effectively resolved, it is worth to be trust and working together.
    5 Stars By John biddlestone from Ecuador - 2017.06.16 18:23
    This enterprise in the industry is strong and competitive, advancing with the times and develop sustainable, we are very pleased to have a opportunity to cooperate!
    5 Stars By Mignon from Toronto - 2017.02.14 13:19
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