Hyper Very Low Profile Copper Foil For High speed digital

Thickness: 12um 18um 35um

Standard Width: 1290mm, Max. width 1340mm; can be cutting as per size request

Wooden box package


Product Detail

Product Tags

Features

Ultra low profile with high peel strength and good etch ability
Use Low coarsening technology, the microstructure makes it an excellent material to apply to high frequency transmission circuit
The treated foil is pink

Typical application

High frequency transmission circuit
Base station/Server
High speed digital
PPO/PPE

Typical Properties of Hyper Very Low profile Copper Foil

Classification

Unit

Test Method

Test Method

Nominal thickness

Um

12

18

35

IPC-4562A

Area Weight

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

Roughness

Shiny side (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

 

Tensile Strength

R.T.(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

≥180

≥180

 

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

H.T.(180°C)

≥6

≥6

≥6

 

Pinholes & Porosity

Number

No

IPC-TM-650 2.1.2

Peel Strength

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650  2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

R.T.(23°C)

Days

90

 

R.T.(200°C)

Minutes

40

 
5G High frequency Board Ultra Low Profile Copper Foil1

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