OEM/ODM China Black Backed Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM


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OEM/ODM China Black Backed Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM Detail:

Detail

● Thickness: 12um 18um 25um 35um 50um 70um 105um
● Standard Width: 1290mm, can be cutting as size request
● Wooden box package
● ID:76 mm, 152 mm
● Length: Customized
● Sample can be supply

Features

This foil is mainly used for multilayered PCBs and high-density circuit boards, which require the surface roughness of the foil to be lower than that of regular copper foil so that their performances such as peeling resistance can remain at a high level. It belongs to a special category of electrolytic copper foil with roughness control. Compared with regular electrolytic copper foil, the crystals of LP copper foil are very fine equiaxed grains (<2/zm). They contain lamellar crystals instead of columnar ones, while they feature flat ridges and a low level of surface roughness. They have such merits as better size stability and higher hardness.

● Low profile for FCCL
● High MIT
● Excellent etchability
● The treated foil is pink or black

Application

● 3layer FCCL
● EMI

Typical properties of Low Profile Copper Foil (LP -S-P/B)

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

25

35

50

70

105

IPC-4562A

Area Weight

g/m²

107±5

153±7

225±8

285± 10

435±15

585± 20

870±30

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Tensile Strength

R.T.(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

H.T.(180°C)

≥138

Elongation

R.T.(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

H.T.(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Resistivity

Ω.g/m²

≤0.17 0

≤0.1 66

≤0.16 2

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Peel Strength(FR-4)

N/mm

≥1.0

≥1.3

≥1.6

≥1.6

≥2.1

IPC-TM-650 2.4.8

Pinholes & Porosity Number

No

IPC-TM-650 2.1.2

Anti-oxidization R.T.(23°C) Days

180

H.T.(200°C) Minutes

30

Standard Width,1295(±1)mm, Width range:200-1340mm. May according to the customer request tailor.

5G High frequency Board Ultra Low Profile Copper Foil1


Product detail pictures:

OEM/ODM China Black Backed Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM detail pictures


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Our primary purpose is to give our shoppers a serious and responsible company relationship, giving personalized attention to all of them for OEM/ODM China Black Backed Copper Foil - Very Low Profile Copper Foil (VLP-S-P/B) – JM , The product will supply to all over the world, such as: Belarus, Holland, British, When It produced, it making use of the world's major method for reliable operation, a low failure price, it appropriate for Jeddah shoppers choice. Our enterprise. s situated inside the national civilized cities, the website traffic is very hassle-free, unique geographical and financial circumstances. We pursue a "people-oriented, meticulous manufacturing, brainstorm, make brilliant" company philosophy. Strict good quality management, fantastic service, affordable cost in Jeddah is our stand around the premise of competitors. If needed, welcome to make contact with us by our web page or phone consultation, we will be delighted to serve you.
  • Goods just received, we are very satisfied, a very good supplier, hope to make persistent efforts to do better.
    5 Stars By Christian from Madagascar - 2017.03.28 16:34
    Production management mechanism is completed, quality is guaranteed, high credibility and service let the cooperation is easy, perfect!
    5 Stars By Kitty from Rome - 2017.06.22 12:49
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