Very Low Profile Copper Foil (VLP-S-P/B)

Sub-micron micro-roughening treatment significantly increases surface area without affecting roughness, which is especially helpful for increasing adhesion strength. 


Product Detail

Product Tags

Sub-micron micro-roughening treatment significantly increases surface area without affecting roughness, which is especially helpful for increasing adhesion strength. With high particle adhesion, there is no worry of particles falling off and contaminating lines. The Rzjis value after roughening is maintained at 1.0 µm and transparency of the film after being etched is also good.

Detail

Thickness: 12um 18um 35um 50um 70um
Standard Width: 1290mm, Width range:200-1340mm, can be cutting as per size request.
Wooden box package
ID:76 mm, 152 mm
Length: Customized
Sample can be supply

Features

The treated foil is pink or black electrolytic copper foil of very low surface roughness. Compared with regular electrolytic copper foil, this VLP foil has finer crystals, which are equiaxed ones with flat ridges, have a surface roughness of 0.55μm, and have such merits as better size stability and higher hardness. This product is applicable to high-frequency and high-speed materials, mainly flexible circuit boards, high-frequency circuit boards, and ultra-fine circuit boards. 
● Very Low profile
High MIT
Excellent etchability

Application

2layer 3layer FPC
EMI
Fine circuit pattern
Mobile phone Wireless charging
High frequency board

Typical properties of Very Low Profile Copper Foil

Classification

Unit

Requirement

Test Method

Nominal thickness

Um

12

18

35

50

70

IPC-4562A

Area Weight

g/m²

107±5

153±7

285± 10

435±15

585± 20

IPC-TM-650 2.2.12.2

Purity

%

≥99.8

IPC-TM-650 2.3.15

roughness

Shiny side (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte side(Rz)

um

≤3.0

≤3.0

≤3.0

≤3.0

≤3.0

Tensile Strength

R.T.(23°C)

Mpa

≥300

IPC-TM-650 2.4.18

H.T.(180°C)

≥180

Elongation

R.T.(23°C)

%

≥5

≥6

≥8

≥10

≥10

IPC-TM-650 2.4.18

H.T.(180°C

≥6

≥6

≥6

≥6

≥6

Peel Strength(FR-4)

N/mm

≥0.8

≥0.8

≥1.0

≥1.2

≥1.4

IPC-TM-650 2.4.8

lbs/in

≥4.6

≥4.6

≥5.7

≥6.8

≥8.0

Pinholes & Porosity Numbers

No

IPC-TM-650 2.1.2

Anti-oxidization R.T.(23°C) Days

180

 
H.T.(200°C)

Minutes

30

/

5G High frequency Board Ultra Low Profile Copper Foil1

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